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UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

Categories Ultra Soft Thermal Pad
Brand Name: AOK
Model Number: UTP100
Certification: RoHS, Reach, UL
Place of Origin: China
MOQ: 1000pcs
Payment Terms: T/T
Delivery Time: 13-15working days
Packaging Details: 400mmx200mm
Product name: Ultra Soft Thermal Pad Cooling gap filling materials with 1.0w thermal conductivity
Composition: Ceramic Filler
Color: Brick Red
Flammability: V-0
Density: 2.5(g/cc)
Thermal conductivity(W/m.K): 1.0
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UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity

AttributeValueTest Method
CompositionCeramic Filler, Silicone, and Reinforced Fiberglass-
ColorWhite and Brick RedVisual
Thickness(mm)0.5~12.0ASTM D374
Density(g/cc)2.5ASTM D792
Hardness(shore oo)30±5ASTM D2240
Tensile Strength(KN/m)2.5ASTM D624
Elongation(%)60ASTM D412
Usage Temperature(℃)-40~150--
Electrical
Breakdown Voltage(kv/mm)≥7.0ASTM D149
Dielectric Constant(@10mhz)5.7ASTM D150
Volume Resistivity(Ω.cm)1.0*1013ASTM D257
FlammabilityV-0UL94
Thermal
Thermal conductivity(W/m.K)1.0±0.1ASTM D5470

Product feature:
■ Thermal Conductivity:1.0 W/m.K
■ Ultra soft and highly compliant
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%


Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs


Purchase information:


Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm


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