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12megapixel 3D AOI Machine Measurement Comparison Optical Inspection

Categories 3D AOI Machine
Brand Name: MENTO
Model Number: K3212
Certification: FCC.ROHS,CCC
Place of Origin: DONGGUAN
MOQ: 3
Payment Terms: L/C, T/T
Supply Ability: 10pcs+20 work days
Delivery Time: 20 work days
Packaging Details: W1350xD1000xH1600mm
aoi: Automated
Pcb Thickness: 0.2mm - 6mm
Dimension: 1000mm x 800mm x 1500mm
Camera: High-resolution digital camera
Light Source: LED
Inspection Accuracy: 99.9%
Software: Advanced image processing software
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12megapixel 3D AOI Machine Measurement Comparison Optical Inspection

Online AOI features

1. High cost performance

2. Standard 5 million global exposure industrial color camera

3. The first company in China to use large-diameter telecentric lenses (can be targeted at products)

4. Independently developed optical system (light source consistency)

5. High stability integrated casting platform

Application scope: solder joint and mounted device inspection


K32 series 3D Solder Paste Inspection


Device modelK3212
Detection capacityDetection itemsMiss print, over solder, insufficient solder, solder bridging, solder paste tailing, shape anomany, offset
Scanning methodStop&Go
Optical systemCamera12MP high-speed color industrial camera
Light SourceDual DLP light source (raster phase shift technology) and red, green and blue (RGB) light source
Resolution10μm & 15um (optional)
Detection performanceHeight accuracy (calibration module)1μm (using standard calibration block)
Volume repeatability<1% (standard verification block, 3Sigma)
Maximum Plate Bending Compensation Value±3mm
Detection Capability GRR<10%at6o(+50%tolerance, 5μm resolution)
Maximum detection height500μm
Solution to shadow problemPhase shift technology & bidirectional 3D Structured Light system
Plate bending real-time compensation methodPlate Bend Compensation (Z-Tracking+Pad Referencing)
Test screenColor (3D and 2D images displayed together)
Driving equipmentServomotor+Screw Guide
Moving speed800mm/s
Minimum measurable product size50mmx50mm
Maximum product measurable size400mmx500mm
PCB thickness0.5~6mm
Track width adjustmentAutomatic width adjustment, manual width adjustment
Circuit board conveying/fixingBelt conveyor/pneumatic clamp fixing
Conveying directionFrom left to right, right to left
Orbital height900±20mm
Computer ConfigurationMainframeCPU: Intel i5, RAM: DDR4-16G, GPU: GTX1660-6GB, SSD:250G, HDD: 2T
Monitor22"LED
Operating systemUbuntu
ParametersOverall sizeW1350xD1000xH1600mm (excluding alarm light)
Weight1100KG
Power sourceAC220V/50~60Hz/2000W
Air Pressure0.5Mpa
Software Supported Input FormatsSupport Gerber format (274X), ODB++
Statistical management tools

Histogram,X-bar&R -Chart ,X-bar&S -C hart ,C p&C pk,

%Gage R & R,SPI Daily/Weekly/Monthly Reports, real-time SPC& Multiple Display

Environmental requirementsTemperature: 5~40℃, relative humidity: 25%~80% (no frost)
Upstream and downstream equipment communicationStandard SMEMA interface

Phase profile measurement principle

Object deforms (modulates) the sinusoidal pattern

Calculate sinusoidal phase and find height (demodulation)


Anti-interference, high precision, large range

1. The moving stripes ensure the ability to resist ambient light interference.

2. High-frequency stripes ensure high enough vertical resolution

3. Low-frequency stripes ensure a wide enough measuring range.



Comprehensive MES data interfacing capabilities and powerful SPC system

1. Real-time statistics of the top ten alarm components

2. The number of alarms can be set to lock the machine

3. Export the entire board image of each PCB in real time for subsequent traceability


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