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Dual Layer Flexible PCB Built on Polyimide With Immersion Gold and Yellow Mask

Categories Flexible PCB Board
Brand Name: Bicheng
Model Number: BIC-253.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Polyimide
Layer count: 2 layers
PCB thickness: 0.15mm
Coverlay: Yellow
Silkscreen: White
Copper weight: 1oz
Surface finish: Immersion gold
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Dual Layer Flexible PCB Built on Polyimide With Immersion Gold and Yellow Mask


Dual Layer Flexible PCB Built on Polyimide With Immersion Gold and Yellow Mask

(FPC’s are custom-made products, the picture and parameters shown are just for reference)


General description

This is a type of flexible printed circuit for the application of analog device. It’s a 2 layer board at 0.15mm thick. The base laminate is from ITEQ, It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Immersion gold is applied on the pads. Stiffener is applied on the connector part.


Parameter and data sheet

Number of Layers2
Board TypeFlexbile cirucit
Board Thickness0.15mm +/-10%
Board MaterialPolyimide (PI) 25um
Board Material SupplierITEQ
Tg Value of Board Material60℃
PTH Cu thickness≥20 um
Inner Iayer Cu thicknesN/A
Surface Cu thickness35 um (1oz)
Coverlay ColourYellow
Number of Coverlay2
Thickness of Coverlay25 um
Stiffener200 um
Type of Silkscreen InkIJR-4000 MW300
Supplier of SilkscreenTAIYO
Color of SilkscreenWhite
Number of Silkscreen2
Mininum Trace (mil)4 mil
Minimum Gap(mil)4 mil
Surface FinishImmersion Gold
RoHS RequiredYes
Famability94-V0
Thermal Shock TestPass, -25℃±125℃, 1000 cycles.
Thermal StressPass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function100% Pass electrical test
WorkmanshipCompliance with IPC-A-600H & IPC-6013C Class 2


Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

Controllability of electrical parameter design

The end can be whole soldered

Low cost

Continuity of processing

Focus on low to medium volume production


Applications

Thin-film switch, mobile phone antenna flex board, automobile GPS navigation flex board


Stiffener

In many applications where there are components soldered, the flexible boards require external stiffeners (Stiffener, also known as the reinforcing board) for external support. The stiffener materials are PI or Polyester film, glass fiber, polymer materials, steel foil, aluminum shim and so on.


(1)PI or Polyester

PI and polyester films are commonly used stiffener materials for flexible circuit board. The commonly used thickness is 125μm (5mil), some hardness can be obtained.


(2)Glass fibers

Glass fibers (such as FR-4), which are also commonly used materials for stiffeners. The fiber glass stiffener has a higher hardness than that of PI or Polyester, used where the requirements of harness is higher. The thickness range is typically 125μm (5mil) to 3.175mm (125mils). However, its processing is relatively difficult than PI, and may not be a standing material for some FPC factories.


(3)Polymer

Polymer, such as plastic, etc. is also used as stiffeners.

Its water absorption is low, with high pressure and high temperature resistance.


(4)Steel foil, aluminum shim

The support hardness of steel foil, aluminum shim is high, the heat can also be dissipated. The hardness or heat dissipation in the design is the main concern.


More Displays of FR-4 Stiffener





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