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| Categories | Glue Potting Machines |
|---|---|
| Electric Rail Width Adjustment: | 200-500mm electrically adjustable for quick changeover |
| Delivery Time: | 30 working days |
| High Component Clearance: | ±110mm upper and lower component height capacity |
| Brand Name: | Haipai |
| SMEMA Integration: | Standard interface for seamless line communication |
| Wide Pressure Range: | -0.12 to 0.6MPa for both vacuum extraction and positive pressure applications |
| Pneumatic Lifting: | Reliable chamber sealing mechanism |
| Certification: | CE,ISO9001 |
| Packaging Details: | Wooden case with vacuum package inside |
| MOQ: | 1 unit |
| Inline Vacuum Processing: | Integrates directly into automated SMT or dispensing lines for continuous production |
| Payment Terms: | T/T |
| Dual Stepper Motor Conveyor: | Fast and precise board transport with independent control |
| Model Number: | HP-450ZK |
| Place of Origin: | China |
| Company Info. |
| Shenzhen Haipai Holding Co., Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
The HP-450ZK Online Vacuum Extraction Machine is a compact inline system designed to remove trapped air and voids from potted electronic assemblies or to create vacuum conditions prior to potting operations. Integrated directly into automated SMT or dispensing lines, this machine provides continuous in-line vacuum processing without the need for batch loading or manual handling.
The chamber internal dimensions of 500mm * 500mm * 200mm accommodate a wide variety of PCB sizes and component heights. The chain conveyor system, driven by dual stepper motors with independent control, ensures fast and precise board transport. Rail width is electrically adjustable from 200-500mm, allowing quick changeover between different board sizes without manual intervention. PCB transmission height is set at 910±20mm for compatibility with standard SMT line heights.
Component height clearance of up to ±110mm on both upper and lower sides accommodates tall components and assemblies with components on both board surfaces. The pneumatic lifting mechanism raises and lowers the chamber or conveyor section to seal the vacuum environment. In-place blocking positioning ensures accurate board location within the chamber before each vacuum cycle.
The system achieves pressure values from -0.12 to 0.6MPa, providing both vacuum extraction and positive pressure capabilities. Control is handled by a PLC with display screen interface for simple operation and real-time monitoring. The steel structure features welded construction with high-temperature paint baking for durability in production environments. The SMEMA interface enables seamless integration into automated SMT lines for fully inline operation.
| Parameter | Specification |
|---|---|
| Model | HP-450ZK |
| Machine Dimensions | L800*W800*H2200mm (including protrusion) |
| Weight | Approx. 500KG |
| Control Method | PLC + Display Screen Control |
| Mechanical Structure | Steel structure welding, high-temperature paint baking |
| PCB Transmission Height | 910±20mm |
| Chamber Internal Dimensions (Effective) | 500mm (L) * 500mm (W) * 200mm (H) |
| Conveyor Type | Chain conveyor |
| Transmission Motor | Dual stepper motor independent control, fast and precise |
| Rail Width | 200-500mm (electric adjustable) |
| Component Height | Upper and lower MAX: ±110mm |
| Lifting Mode | Pneumatic |
| Positioning Method | In-place blocking positioning |
| Pressure Value | -0.12 to 0.6MPa |
| Power Supply (including vacuum pump) | AC220V 50Hz, 500W / AC380V 50Hz |
| Equipment Air Pressure | 0.4-0.6MPa |
| Interface | SMEMA |
Industry Keywords Tag Cloud :
Core Equipment Terms: Glue Potting Machine, Automatic Potting System, Two-Component Potting Equipment, Vacuum Potting Machine, Meter Mix Dispense System, Inline Potting Production Line, Dual-Component Dispensing System, Heavy-Duty Potting Machine, Resin Dispensing System
Processing & Technology Keywords: Fluid Potting Process, Deep Section Resin Filling, Two-Part Metering Mixing, Dynamic Fluid Mixing, Static Mixing Technology, Variable Ratio Dispensing, Bubble-Free Potting, Continuous Liquid Feeding, Volumetric Piston Pump Metering, Gear Pump Fluid Dispensing
Material Compatibility Keywords: Two-Component Epoxy Resin, Polyurethane Potting Compound, Two-Part Silicone Elastomer, Thermal Conductive Potting Resin, Polyurethane Foam Gasketing, Flame Retardant Protective Resin, Low Viscosity Liquid Polyurethane, A and B Component Resin
Manufacturing & Application Keywords: Power Supply Protection, Battery Management System Protection, BMS Potting, Automotive Electronics Potting, Ignition Coil Sealing, Transformer Potting, Capacitor Protective Sealing, LED Driver Waterproof Sealing, Industrial Automation Module Insulation, Renewable Energy Electronics Protection
Performance & Inspection Keywords: Precision Mixing Ratio Control, Continuous Uniform Flow, Anti-Drip Dispensing Valve, Automated Fluid Temperature Regulation, Material Tank Agitation System, Vacuum Degassing Technology, Automatic Weight Calibration, Multi-Axis Motion Potting Path, Industrial IoT Monitoring
Quality & Curing Keywords: Potting Volume Quality Control, Resin Level Detection, Curing Process Management, Thermal Curing Tunnel Oven, Infrared Rapid Curing, Defect-Free Potting Verification, Quality Assurance Tracking, Process Validation, Turnkey Potting Line Solution
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