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| Categories | SMT Assembly |
|---|---|
| Payment Terms: | Western Union,T/T |
| Packaging Details: | Vacuum packaging+Cardboard box |
| Turnaround: | 8 Hours |
| BGA Pitch / BGA: | Min 0.35mm Pitch |
| Place of Origin: | Shenzhen, China |
| Supply Ability: | 1000000PCS |
| Application: | AI Edge Computing, Medical Imaging, Industrial Tablet |
| Inspection: | 100% AOI + X-Ray |
| Technology: | HDI with Micro-Vias |
| Component Size: | 0201 (0.6mm x 0.3mm) |
| Model Number: | QH-5071 |
| Material: | High-TG FR-4 (Halogen Free) |
| Surface Finish: | ENIG (Electroless Nickel Immersion Gold) |
| Brand Name: | QHPCBA |
| Price: | $10 |
| Min Trace/Space: | 2.5mil |
| MOQ: | 1 |
| Certification: | UL |
| Layer Count: | 8-12 Layers HDI (Blind/Buried Vias) |
| Delivery Time: | 6day |
| Company Info. |
| Shenzhen Jingchengjie Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
High-Density HDI Multi-Layer Embedded Control Board - Gold Finish
Complexity: This board features a high-density SoC/FPGA BGA design, surrounded by 0201 passive components, requiring extreme precision in SMT placement.
Interconnect Technology: Utilizes advanced HDI (High-Density Interconnect) with blind and buried vias to manage complex signal routing in a compact form factor.
Interface Rich: Integrated with multiple FPC/FFC connectors (J10-J26), SIM/MicroSD slots, and high-speed display interfaces.
| Feature | QHPCBA (Factory‑Direct) | Generic Platforms |
|---|---|---|
| Response Time | Direct Engineering Review | 12‑24h Customer Support Ticket |
| Production Speed | 8 Hours (SMT) | 3‑7 Days (Standard) |
| Middleman Markup | 0% (Factory Pricing) | Platform Commission Fees |
| DFM Feedback | Active & Collaborative | Automated "Reject" |
| Facility Access | Visit Our Shenzhen Factory | Virtual/Office Address |
Our factory specializes in the rapid prototyping of complex HDI boards, ensuring structural integrity and signal fidelity.
Ultra-Precision Stencil (2-Hour): Custom laser-cut stencils with nano-coating options for perfect BGA solder release.
Rapid PCB Fabrication (24-48H): Specialized supply chain for multi-layer HDI prototyping.
Expert SMT Assembly (8-Hour): Equipped with high-speed Yamaha/Pana-sonic mounters capable of 01005 component placement and X-Ray BGA inspection.
X-Ray Inspection: 100% inspection for BGA & QFN internal soldering.
AOI Testing: Full automated optical inspection for all SMT components.
Impedance Control: Strict tolerance matching for high-speed differential pairs.
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SMT Solder Paste Stencil Assembly Production Turnkey Service with High Precision Manufacturing Including Testing
Fast Turn PCBA Prototype Assembly Turnkey Service with Quick Manufacturing Including Testing
Automotive Grade PCBA Assembly Turnkey Manufacturing Service with Quality Verification Including Testing
HDI Halogen Free PCBA Assembly 8-12 Layer Turnkey Service with Quick Manufacturing Including Testing
