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High Transparency Epoxy Potting Compound 2:1 Self-Leveling AB Glue 70D for LED Module High Voltage Insulation

Categories Epoxy Potting Compound
Certification: RoHS, REACH
Place of Origin: Guangdong, China
Delivery Time: 3-5 working days for sample, 10-15 days for bulk order
Payment Terms: T/T, L/C, PayPal, Western Union
Brand Name: Hanast
Temperature Resistance (°C): -40 to 120
Curing Time at 25°C (h): 12-24
Packaging Details: 30Kg per set (Part A 20Kg + Part B 10Kg), packed in iron drums, sealed at room temperature, transported as non-dangerous goods, shelf life 6 months
Viscosity (mPa·s): Low viscosity, self-leveling
Dielectric Strength: Excellent electrical insulation
Mix Ratio (A:B): 2:1 by weight
Color: Transparent
Thermal Conductivity (W/m·K): 0.2-0.3
MOQ: 30 Kilograms
Supply Ability: 50,000 Kilograms per Month
Model Number: HN-5506A/B
Price: USD 10-20 / Kilogram
Hardness (Shore D): 70-75
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High Transparency Epoxy Potting Compound 2:1 Self-Leveling AB Glue 70D for LED Module High Voltage Insulation

High Transparency Epoxy Potting Compound HN-5506A/B – 2:1 Self-Leveling AB Glue

Hanast HN-5506A/B is a high transparency two-component epoxy potting compound designed for electronic encapsulation applications where optical clarity and high voltage insulation are critical. With a 2:1 mix ratio by weight and self-leveling low-viscosity formulation, it flows effortlessly into narrow gaps and complex component structures before curing to a crystal-clear, hard protective layer at 70-75 Shore D.

Key Features

  • High Optical Transparency – Maintains exceptional clarity and light transmittance after full cure, ideal for LED modules and applications where visual inspection or light emission is required
  • Self-Leveling Low Viscosity – Naturally flows to fill complex geometries without air entrapment, minimizing manual intervention during dispensing
  • Excellent High Voltage Insulation – Superior dielectric strength prevents current leakage and short circuits in high voltage electronic assemblies
  • 2:1 Convenient Mix Ratio – Standard weight ratio (Part A 20Kg : Part B 10Kg per set), compatible with automatic dispensing equipment for mass production
  • Moisture-Proof & Chemical Resistant – Forms a robust protective barrier against humidity, water ingress, vibration, and chemical corrosion
  • Anti-Tamper Security – Cures to a hard, disassembly-resistant finish that provides confidentiality protection and reverse-engineering prevention for sensitive circuit boards
  • RoHS & REACH Compliant – Meets international environmental standards for electronics manufacturing supply chains

Technical Specifications

ParameterHN-5506A/BTest Method
Appearance (Part A)Transparent liquidVisual
Appearance (Part B)Transparent liquidVisual
Mix Ratio (A:B)2:1 by weight
ViscosityLow viscosity, self-levelingGB/T 2794
Hardness (Shore D)70 – 75ASTM D2240
Thermal Conductivity (W/m·K)0.2 – 0.3ASTM E1530
Temperature Resistance (°C)-40 to +120Thermal cycling test
Pot Life at 25°C (min)30 – 40Internal
Cure Time at 25°C (h)12 – 24Internal
Accelerated Cure (60°C)2 – 3 hInternal
Dielectric StrengthExcellentASTM D149
Packaging30 Kg/set (A:20 Kg + B:10 Kg)

Recommended Applications

  • LED Module Encapsulation – Crystal-clear potting for LED display modules, LED strips, and lighting fixtures requiring uninterrupted light transmission and weatherproof protection
  • High Voltage Insulation Potting – Reliable dielectric encapsulation for transformers, high voltage flyback transformers, ignition coils, and power supply modules
  • Capacitor & Electronic Component Sealing – Moisture-proof and vibration-resistant encapsulation for sensitive electronic components and circuit boards
  • Anti-Tamper PCB Protection – Hard, non-removable seal that prevents reverse engineering and unauthorized access to proprietary circuit designs
  • Decorative Craft Casting – High-gloss transparent casting resin for handmade crafts, jewelry, and decorative objects requiring optical clarity

Wholesale Supply & China Factory Direct

As a bulk epoxy potting compound manufacturer in China, Hanast supplies HN-5506A/B in standard 30 kg sets with full MSDS and TDS documentation per batch. Sample orders shipped via FedEx/DHL express (3-5 working days), bulk orders dispatched by sea freight with 10-15 days production lead time. Custom packaging and private label options available for OEM partners.

Mixing & Application Guide

  1. Weigh Part A and Part B at a precise 2:1 ratio by weight (use an electronic scale, not volume measurement)
  2. Mix thoroughly for 2-3 minutes until uniformly blended
  3. Vacuum degas for 3-5 minutes to eliminate entrapped bubbles
  4. Pour slowly into the prepared mold or component cavity within 30-40 minute pot life
  5. Allow to cure at room temperature (25°C) for 12-24 hours, or heat at 60°C for 2-3 hours for faster production turnaround

Contact us today to request a free sample, discuss custom formulations, or obtain wholesale pricing from our China factory.

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