| Sign In | Join Free | My lightneasy.org |
|
| Sign In | Join Free | My lightneasy.org |
|
| Categories | Thermal Pad |
|---|---|
| Brand Name: | Ziitek |
| Model Number: | TIF™100-11S |
| Certification: | UL and RoHs |
| Place of Origin: | Vietnam |
| MOQ: | 1000pcs |
| Price: | 0.1-10 USD/PCS |
| Payment Terms: | T/T |
| Supply Ability: | 100000pcs/day |
| Delivery Time: | 3-5 work days |
| Packaging Details: | 24*13*12cm cartons |
| Products name: | Silicone thermal pad thermal gap pad |
| Thermal Conductivity: | 1.5W/mK |
| Density: | 2.3 g/cm³ |
| Keywords: | Thermal Pad |
| Color: | Dark Gray |
| Hardness: | 45Shore 00 |
| Dielectric Breakdown Voltage: | >5500VAC |
| Application: | Telecommunication hardware |
| Company Info. |
| CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM |
| Verified Supplier |
| View Contact Details |
| Product List |
TIF100-11S Silicone thermal pad thermal gap pad
The TIF™100-11S series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 1.5W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> RoHS compliant
> UL recognized
Applications:
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
| Typical Properties of TIF100-11S Series | ||
| Property | Value | Test method |
| Color | Dark Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Density | 2.3g/cm³ | ASTM D297 |
| Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ****** |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 160℃ | *** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity(Ohm-cm) | 1.0X1012 | ASTM D257 |
| Fire rating | 94 V0 | UL equivalent |
| Thermal conductivity | 1.5W/m-K | ASTM D5470 |
| Outgassting(TML) | 0.35% | ASTM E595 |
Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)
Products Size:
8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.
Vietnam Ziitek Technology Company Limited is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
|
TIF100-10-02S Thermal pad
TIF100-10-01U Thermally Conductive Gap Filler Pads
TIF100-10-02F Silicone Thermal Pad
TIF100-66U Custom Laptop Hard Drive GPU CPU Thermal Conductive Pad
TIF100-16-38UF Silicone Thermal Pad Thermal Gap Filler Pad
TIF100-18-56U Ultra-soft thermal pad
TIF100-20-11US Ultra-soft silicone thermal pad
TIF100-25-02F Ultra-Soft Silicone Thermal Conductive Pad
TIF100-30-02 Ultra-Soft Silicone Thermal Conductive Gap Filler Pad
TIF100-40-11U Thermal Pad For GPU CPU Chip
