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Categories | BGA X Ray Inspection Machine |
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Brand Name: | UNICOMP |
Model Number: | CX3000 |
Certification: | CE, FDA |
Place of Origin: | China |
MOQ: | 1Set |
Price: | can negotiate |
Payment Terms: | T/T,L/C |
Supply Ability: | 30 sets per month |
Delivery Time: | 30 days |
Packaging Details: | Wooden Case, Waterproof, Anti-collision |
Name: | BGA X-Ray Inspection Machine |
X-ray Coverage: | 48mm x 54mm |
Industry: | Electronics Industry |
Resolution: | 208Lp/cm |
X-ray Leakage: | < 1uSv/h |
Power Consumption: | 0.5kW |
Company Info. |
Unicomp Technology |
Verified Supplier |
View Contact Details |
Product List |
Micro-focus x-ray cabinet systems BGA X-Ray Inspection Machine
Item | Definition | Specs |
System Parameters | Size | 750(L)x570(W)x890(H)mm |
Weight | 300kg | |
Power | 220AC/50Hz | |
Power Consumption | 0.5kW | |
X-ray Tube | Type | Closed |
Max.Voltage | 100kV | |
Max.Power | 200μA | |
Spot Size | 5μm | |
Detector | Intensifier | FPD |
X-ray Coverage | 48mm x 54mm | |
Resolution | 208Lp/cm | |
Work Station | Max.Loading Size | 200mm x 200mm |
Max.Inspection Area | 200mm x 200mm | |
Oblique Angle Views | 360° rotary fixture (Optional) | |
X-ray Leakage | <1μSv/h |
X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system.
Application:
1.BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient
2.QFN:Bridging,Voids,Opens,Registration
3.SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others
4.Semiconductor:
bond wire,die attach VOID ,MOLD,VOID
5.Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias
Inspection Images:
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