0.54 MP MONO Global Shutter 68 Perspective MIPI Camera Module With VD55H1 Sensor

0.54 MP MONO Global Shutter 68 Perspective MIPI Camera Module With VD55H1 Sensor

1. Basic Parameters:

‑ Resolution: 672(H)×804(V), 0.54MP. It enables high‑density 3D depth point acquisition with rich imaging details and high‑fidelity spatial reconstruction.

‑ Pixel Size: 4.6μm(H)×4.6μm. Adopting CDTI charge‑domain pixel architecture combined with back‑illuminated design, it balances photosensitivity and imaging stability and effectively reduces imaging noise.

‑ Optical Format: 1/4‑inch. Compact in size, it is suitable for integration design of various miniature modules.

‑ Supply Voltage: Core voltage 1.1V, interface voltage 1.8V, analog voltage 2.8V. It can operate stably under various voltage conditions to ensure sensor reliability.

‑ Temperature Range: Operating temperature ranges from ‑30℃ to 85℃. Its wide operating temperature range allows adaptation to diverse working environments.

2. Technical Features:

‑ Global Shutter Technology: The global shutter design effectively eliminates motion blur and illumination artifacts while lowering power consumption for illumination.

‑ It adopts 65‑nm stacked Back‑Side Illuminated (BSI) wafer process and is equipped with a dedicated 940 nm infrared photosensitive system. Its demodulation contrast reaches over 85%, delivering excellent resistance to ambient light interference. It can output high‑definition and clean depth images under complex low‑light and high‑light conditions.

‑ Supporting high‑frequency modulation at 200 MHz, it achieves greatly reduced depth noise compared with conventional hundred‑megahertz ToF sensors. Typical ranging distance reaches 5 m under full‑resolution mode, and the ranging distance can be further extended under patterned illumination conditions, featuring high ranging accuracy and wide detection range.

‑ VD55H1 MONO Camera Module: Compatible with standard modules with different lens configurations such as 68° to meet diverse customer requirements.

3. Application Fields:

It is applied in virtual reality / augmented reality, biometric recognition, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.

4. Customization Services:

Custom modules can be produced according to customer requirements to deliver tailor‑made products matching customers’ needs.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.