0.56 MP MONO Global 160.3 - Degree View Shutter Camera Module VD55G4 Sensor For Machine Vision

0.56 MP MONO Global 160.3 - Degree View Shutter Camera Module VD55G4 Sensor For Machine Vision

1. Basic Parameters:

‑ Resolution: 804 (H) × 704 (V), 0.56MP. Optimized for lightweight high‑precision visual acquisition scenarios, balancing imaging clarity and low‑load device requirements.

‑ Pixel Size: 2.16μm (H) × 2.16μm (V). Features an optimized pixel structure design that reduces sensor size while delivering excellent light‑sensing performance and imaging accuracy.

‑ Optical Format: 1/9‑inch. Boasts outstanding quantum efficiency, optimized for near‑field sensing, low‑light imaging and dynamic scenes with strong anti‑interference imaging capability.

‑ Supply Voltage: Core voltage 1.1V, interface voltage 1.8V, analog voltage 2.8V. It operates stably under various voltage conditions to ensure sensor reliability.

‑ Temperature Range: Operating temperature from ‑30℃ to 85℃. The wide operating‑temperature range enables adaptability to diverse working environments.

2. Technical Features:

‑ Global Shutter Technology: The global‑shutter design effectively eliminates motion blur and illumination artifacts while lowering power consumption requirements for lighting.

‑ Adopts advanced 3D‑stacked and BSI (Back‑Side Illumination) processes. Circuits and light‑sensitive layers are arranged in separate layers, greatly shrinking sensor dimensions with minimal overall footprint. It features high integration and simple peripheral matching circuits, supports multiple data‑output formats including RAW8 and RAW10, and is compatible with the common MIPI CSI interface. With strong hardware compatibility, it can be rapidly integrated into various compact smart devices to shorten product R&D and implementation cycles.

‑ Multiple embedded image‑enhancement functions are integrated, including auto‑exposure, intelligent noise reduction, pixel defect correction, multi‑exposure fusion and more. It can output high‑definition, low‑noise, high‑contrast images without an external dedicated image‑processing chip. The product achieves a dynamic range of 68dB, maintaining clear and stable imaging under complex lighting conditions such as alternating bright‑dark scenes and low‑light environments, and effectively improving visual‑recognition accuracy.

‑ VD55G4 Camera Module: Supports standard modules with different lens configurations including 160.3° to meet diverse customer requirements.

3. Application Fields:

Applied in virtual reality / augmented reality, biometric identification, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.

4. Customization Services:

Custom‑built modules can be produced according to customer requirements to deliver tailor‑made products.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.